Mfg Part Number: IDT7188L55DB | Manufacturer: Integrated Device Technology Inc | NSN : 5962-01-350-3944 |
NIIN : 013503944 | Item Name : microcircuit memory | CAGE Code : 61772 |
FSC : 5962 Microcircuits Electronic |
Stacked Aerospace is an industry-leading distributor of NSN parts, including NSN 5962-01-350-3944. We are owned and operated by ASAP Semiconductor and offer some of the fastest lead times and most cost-effective solutions in the industry. This premium NSN part IDT7188L55DB is manufactured by Integrated Device Technology Inc and is listed alongside the Part Number IDT7188L55DB and description Microcircuit Memory. If you would like to receive a quick quote for this part, just fill out the Instant RFQ form provided on this page. Once you have submitted your request, one of our experts will review it and return with a personalized quote within 15 minutes or less.
Stacked Aerospace is your sourcing solution for Integrated Device Technology Inc parts with the CAGE Code 61772 and other NSN components. National Stock Numbers (NSNs) are 13-digit numeric codes assigned to unique items manufactured, bought, and sold within the federal supply chain. This codification system has been used by the U.S. since WWII and has since been adopted by all NATO-allied Nations. All of the items we offer, including 5962-01-350-3944, ship quickly from one of our international supply-chain locations with full traceability. Additionally, we ensure that much of our inventory is subjected to rigorous quality assurance testing to ensure customers receive the highest quality items. Submit an RFQ today for NSN part IDT7188L55DB and see how we can meet your parts requirements with ease.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-350-3944 Item Description: Microcircuit Memory | 5962 | 013503944 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Idt7188l55db | 5 | 8 | E |
MRC | Criteria | Characteristic |
---|---|---|
ABKW | OVERALL HEIGHT | 0.225 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
ABMK | OVERALL WIDTH | 0.280 INCHES MINIMUM AND 0.320 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 1.050 INCHES MINIMUM AND 1.260 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.260 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.040 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND ELECTROSTATIC SENSITIVE AND STATIC OPERATION |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 19 INPUT |
CTQX | CURRENT RATING PER CHARACTERISTIC | 115.00 MILLIAMPERES MAXIMUM SUPPLY |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 55.00 NANOSECONDS MAXIMUM ACCESS |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT,DIGITAL,SRAM |
AGAV | END ITEM IDENTIFICATION | 6605-01-318-5607 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZER | MEMORY DEVICE TYPE | RAM |
TTQY | TERMINAL TYPE AND QUANTITY | 22 PRINTED CIRCUIT |
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