| Mfg Part Number: F10NB L01 0001 | Alternate P/N: F10NBL010001 | Manufacturer: Fei Microwave Inc |
| NSN : 5961-00-175-2844 | NIIN : 001752844 | Item Name : semiconductor devic |
| CAGE Code : 21847 | FSC : 5961 Semiconductor Devices and Associated Hardware |
Stacked Aerospace is an industry-leading distributor of NSN parts, including NSN 5961-00-175-2844. We are owned and operated by ASAP Semiconductor and offer some of the fastest lead times and most cost-effective solutions in the industry. This premium NSN part F10NB L01 0001 is manufactured by Fei Microwave Inc and is listed alongside the Part Number F10NB L01 0001 and description Semiconductor Devic. If you would like to receive a quick quote for this part, just fill out the Instant RFQ form provided on this page. Once you have submitted your request, one of our experts will review it and return with a personalized quote within 15 minutes or less.
Stacked Aerospace is your sourcing solution for Fei Microwave Inc parts with the CAGE Code 21847 and other NSN components. National Stock Numbers (NSNs) are 13-digit numeric codes assigned to unique items manufactured, bought, and sold within the federal supply chain. This codification system has been used by the U.S. since WWII and has since been adopted by all NATO-allied Nations. All of the items we offer, including 5961-00-175-2844, ship quickly from one of our international supply-chain locations with full traceability. Additionally, we ensure that much of our inventory is subjected to rigorous quality assurance testing to ensure customers receive the highest quality items. Submit an RFQ today for NSN part F10NB L01 0001 and see how we can meet your parts requirements with ease.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-00-175-2844 Item Description: Semiconductor Devic | 5961 | 001752844 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | U | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| F10NB L01 0001 | 2 | 2 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | CERAMIC ALL SEMICONDUCTOR DEVICE DIODE |
| ABHP | OVERALL LENGTH | 0.190 INCHES MINIMUM ALL SEMICONDUCTOR DEVICE DIODE AND 0.210 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
| ADAV | OVERALL DIAMETER | 0.078 INCHES MINIMUM ALL SEMICONDUCTOR DEVICE DIODE AND 0.084 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
| AFZC | FUNCTION FOR WHICH DESIGNED | DETECTOR AND MIXER |
| ASDD | COMPONENT FUNCTION RELATIONSHIP | MATCHED |
| ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
| AXGY | MOUNTING METHOD | PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION ALL SEMICONDUCTOR DEVICE DIODE |
| FEAT | SPECIAL FEATURES | 9.3 GHZ TEST FREQUENCY; 6.5 DECIBEL NOISE FIGURE |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 BINDING POST ALL SEMICONDUCTOR DEVICE DIODE |
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